AMD Strix Halo is mentioned as "Ryzen AI MAX 300" in the latest chipset driver release notes on ASUS's official website.
AMD chipset driver v6.10.02.1849 confirms the "Ryzen AI MAX 300" naming convention for next-gen Strix Halo "Premium" APUs
Turns out that the "Ryzen AI Max 300" naming convention is real. We had a few reports previously that claimed that the upcoming high-performance Strix Halo APUs from AMD will bring a naming convention similar to Strix Point chips.
The recent leak comes from ASUS's official website through the leaker @9550pro(HXL), which found out that the latest AMD chipset driver v6.10.02.1849 supports the upcoming Ryzen AI MAX 300 chips or Strix Halo. The series is mentioned in the release notes along with other CPU series.
AMD Ryzen AI Max 300 or Strix Halo will be the most powerful APU series to date, featuring up to 16 Zen 5 cores and 40 Compute Units for its RDNA 3.5-based integrated graphics. Currently, the maximum number of Compute Units we have is 16 on the Strix Point APUs, which feature up to Radeon 890M graphics. The Strix Point APUs aka Ryzen AI 300 processors are quite sufficient for playing most games at 1080p but the Ryzen AI Max 300 will upgrade the gaming performance drastically.
Apart from the gaming systems, the chips are reportedly also designed for workstations as we previously found on Geekbench. As these chips boast powerful integrated graphics, the workstation or the gaming systems won't necessarily require a dedicated GPU, especially if the horsepower needed is equivalent to budget graphics cards such as GTX 1660 or similar. As per the leaked reports, there are three SKUs in the lineup, featuring 8 cores to 16 core configurations and GPUs with 32-40 CUs.
AMD Ryzen AI MAX 300 "Strix Halo" APU Lineup:
| SKU Name | Architectures | CPU Cores | Max Clock | Cache | GPU Cores | TDP |
|---|---|---|---|---|---|---|
| Ryzen AI Max+ 395 | Zen 5 / RDNA 3.5 | 16 / 32 | 5.1 GHz | 80 MB | 40 CUs (Radeon 8060S) | 45-120W |
| Ryzen AI Max 390 | Zen 5 / RDNA 3.5 | 12 / 24 | 5.0 GHz | 76 MB | 40 CUs (Radeon 8060S) | 45-120W |
| Ryzen AI Max 385 | Zen 5 / RDNA 3.5 | 8 / 16 | 5.0 GHz | 40 MB | 32 CUs (Radeon 8050S) | 45-120W |
| Ryzen AI Max 380 | Zen 5 / RDNA 3.5 | 6 / 12 | 4.9 GHz | 22 MB | 16 CUs (Radeon 8040S) | 45-120W |
The AMD Ryzen AI Max 300 "Strix Halo" APUs will feature support on the FP11 socket with a total of 2077 pins arrange in a BGA array.
AMD Ryzen AI HX Strix Halo Expected Features and Specs:
- Zen 5 Chiplet Design
- Up To 16 Cores
- 64 MB of Shared L3 cache
- 40 RDNA 3+ Compute Units
- 32 MB MALL Cache (for iGPU)
- 256-bit LPDDR5X-8000 Memory Controller
- XDNA 2 Engine Integrated
- Up To 60 AI TOPS
- 16 PCIe Gen4 Lanes
- 2H 2024 Launch (Expected)
- FP11 Platform (55W-130W)
Thankfully, the Strix Halo APUs will have their integrated graphics supported on ROCm as well. This will equip developers with powerful tools not seen before on platforms bringing just integrated graphics. The AMD Ryzen AI 300 Max chips are expected to be revealed at CES 2025 along with some Ryzen 9000X3D CPUs.
Apart from Ryzen AI 300 Max, there are a couple of more affordable Zen 5-based chips such as Krackan Point and Z2 Extreme, which AMD is planning to release in early 2025 for gaming handhelds to ensure better performance and improved battery life.
News Sources: @9550pro, ASUS, @harukaze5719
